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Comparison ledger

ConnX Eliteversus10100

Kulicke & Soffa ConnX Elite, West Bond 10100, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
ConnX EliteKulicke & Soffa
10100West Bond
OEMKulicke & SoffaWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyKulicke & Soffa ConnxWest Bond 10100
Cited variants
  • ConnX ELITE Opto LA (Large Area)[1]
  • ConnX ELITE Opto ELA (Extended Large Area)[1]
—
Specifications
Configuration50/60 Hz[2]—
Bondable area56 x 80 mm[3]—
Placement accuracy3 µm (3 sigma)[4]—
Bonding methodWire Bonder[4]—
Bonding wire length5 mm[4]—
Die pad downsetUp to 2.3 mm[4]—
Gold wire size25.4 µm[4]—
Leadframe dimensions300 x 92 mm[4]—
Magazine dimensions305 x 98 x 178 mm[4]—
Minimum loop height65 µm[4]—
Wire pitch1.27 to 25 mm[4]—
Wire sway25 µm[4]—
Air consumption185 L/min[4]—
Air pressure3.52 kg/sq cm[4]—
Power supply200-240 VAC, -15% to 10%, Single Phase, 50/60 Hz, 2.6 KVA[4]—
Net weight556 kg[4]—
Overall dimensionsBase Machine with MHS x 889 x 990 mm[4]—

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Sources (4)Every fact above is drawn from these public sources
  1. [1]zaratech.bizzaratech.biz
  2. [2]inventory listing
  3. [3]kns.comkns.com
  4. [4]semiconductor.directorysemiconductor.directory