Comparison ledger
KLA Candela CS 20 V Surface Analyzer, Lapmaster 12 Benchtop Lapping Polishing, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 12 Benchtop Lapping PolishingLapmaster | |
|---|---|---|
| OEM | KLA | Lapmaster |
| Category | CMP | CMP |
| Wafer size | 2" | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA Candela CS 20 | Lapmaster 12 Benchtop Lapping Polishing |
| Cited variants |
| — |
| Specifications | ||
| Configuration | Violet Laser (405nm, 25mW)[1] | Ring lapper[7] |
| Phase | Laser: 405 nm, 25 mW diode - Spot size: 5 × 6 µm Detection modes: - Scattered light - Specular reflection - Phase shift - Surface topography[2] | — |
| Wafer size | Wafer Handling: - Sizes: 2", 3", 4", 5", 6", 8" - Thickness: 0.2–1.1 mm - Automatic robotic transfer - Cassette-to-cassette operation[2] | — |
| Laser wavelength | 405 nm[2] | — |
| Laser power | 25 mW[2] | — |
| Spot size | 5 × 6 µm[2] | — |
| Detection modes | Scattered light, specular reflection, phase shift, surface topography[2] | — |
| Wafer sizes supported | 2", 3", 4", 5", 6", 8"[2] | — |
| Wafer thickness range | 0.2–1.1 mm[2] | — |
| Particle detection threshold | 0.08 µm (PSL equivalent)[2] | — |
| Particle detection rate | ≥95% on polished wafers[2] | — |
| Scratch detection dimensions | Length: 100 µm, Width: 0.1 µm, Depth: 50 Å[2] | — |
| Pit/Bump detection dimensions | Diameter: 20 µm, Depth: 50 Å[2] | — |
| Stain detection dimensions | Diameter: 20 µm, Film thickness: 10 Å[2] | — |
| Topography vertical resolution | 1 Å[2] | — |
| Wafer handling | Automatic robotic transfer, cassette-to-cassette[2] | — |
| Operating system | Windows XP[3] | — |
| Power supply | 230 VAC 50/60 Hz[3] | — |
| Cleanroom environment | Internal class 10[3] | — |
| Wafer sizes | 2", 3", 4", 5", 6", 8"[2] | — |
| Particle detection minimum size | 0.08 µm (PSL equivalent)[2] | — |
| Particle detection rate (polished wafers) | ≥95%[2] | — |
| Scratch detection minimum length | 100 µm[2] | — |
| Scratch detection minimum width | 0.1 µm[2] | — |
| Scratch detection minimum depth | 50 Å[2] | — |
| Pit/Bump detection minimum diameter | 20 µm[2] | — |
| Pit/Bump detection minimum depth | 50 Å[2] | — |
| Stain detection minimum diameter | 20 µm[2] | — |
| Stain detection minimum film thickness | 10 Å[2] | — |
| Vintage | 2012[1] | — |
| Make | — | Lapmaster[4] |
| Model | — | 12[4] |
| Category | — | CMP[5] |
| Type/Application | — | Single sided[6] |
| Plate diameter | — | 12 in[6] |
| No. of conditioning rings | — | 3[7] |
| Base | — | Rigid, lightweight, cast aluminum base[7] |
| Standard RPM | — | 60 RPM[7] |
| RPM range with variable speed drive | — | 0-60[7] |
| Drive motor - lapper | — | 0.5 HP[7] |
| Drive motor - polisher | — | 0.75 HP[7] |
| Length | — | 25 in[7] |
| Width | — | 18 in[7] |
| Height | — | 24 in[7] |
| Estimated shipping weight | — | 240 lbs[7] |
| Approximate weight | — | 135 lbs / 61 kg[8] |
| Approximate dimensions | — | 24.5 in × 17.5 in × 23.8 in (622 mm × 445 mm × 607 mm)[8] |
| Electrical system | — | Various voltages; 50/60 Hz; 1 phase and 3 phase to customer specification[8] |
| Motor | — | 1/3 hp / 0.25 kW motor with gear reducer[8] |
| Abrasive feed system | — | Designed for water or oil based lapping slurries[8] |
| Automatic cycle timer | — | Automatic digital cycle timer[8] |
| Ring configuration | — | Ring lapper[7] |
| Ring ID | — | 4.25 inches[7] |