Comparison ledger
KLA 0035235-003 MMD Head, Rudolph 3Di, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 3DiRudolph | |
|---|---|---|
| OEM | KLA | Rudolph |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | Whole wafers 75 mm-300 mm; sawn wafers up to 300 mm on film frames |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA 0035235-003 MMD Head | Rudolph 3Di |
| Specifications | ||
| Configuration | TSTD PCB ASSY, MMD MEAS HEAD[1] | — |
| Model | 0035235-003[1] | — |
| Make | KLA[1] | — |
| Part Description | TSTD PCB ASSY, MMD MEAS HEAD[1] | — |
| Compatible System | KLA AIT-XP[1] | — |
| Inspection capabilities | — | Complete high-throughput, high-accuracy, 100% bump and wafer inspection in one system[2] |
| 3D sensor | — | Revolutionary RCS sensor for 3D inspection and metrology[2] |
| 2D inspection | — | Industry leading 2D inspection and metrology[2] |
| Application flexibility | — | All bump processes and materials; under bump metalization (UBM); pre- and post-reflow; other wafer level packaging inspection including redistribution lines, thick films, vias, and intermediate interconnects[2] |
| Wafer handling | — | Whole wafers 75 mm-300 mm; sawn wafers up to 300 mm on film frames[2] |
| Wafer size | — | Whole wafers 75 mm-300 mm; sawn wafers up to 300 mm on film frames[2] |
| Inspection capability | — | Complete high-throughput, high-accuracy, 100% bump and wafer inspection in one system[2] |
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