Comparison ledger
Karl Suss MA-4, SUSS MicroTec ACS200, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | MA-4Karl Suss | ACS200SUSS MicroTec |
|---|---|---|
| OEM | Karl Suss | SUSS MicroTec |
| Category | Lithography | Lithography |
| Wafer size | 100mm | 100mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | i-line |
| Family | Karl Suss MA-4 | SUSS MicroTec ACS200 |
| Specifications | ||
| OEM | Karl Suss[1] | — |
| Model | MA-4[1] | — |
| Equipment type | Mask Aligner[1] | — |
| Substrate size | Up to 4" (100mm) in diameter[1] | — |
| Sample compatibility | Works for smaller samples[1] | — |
| Alignment mode | Contact/proximity aligner[1] | — |
| Illumination wavelengths | 365 nm or 405 nm[1] | — |
| Backside alignment | Real-time infrared through-wafer backside alignment[1] | — |
| Tool type | — | Modular cluster tool[2] |
| Process | — | Coating and development of i-line photoresists[2] |
| Loading/unloading ports | — | Two loading/unloading ports: one cassette for coating and one cassette for development[2] |
| Wafer centering | — | Wafer centering station[2] |
| Spin-coating modules | — | Two spin-coating modules[2] |
| Development module | — | One development module with puddle and spray options[2] |
| Hotplates and coolplates | — | Two stacks of hotplates (9 in total) and coolplates (3 in total)[2] |
| HMDS priming | — | Additional HMDS-priming module[2] |
| Wafer handling | — | Standard SEMI-wafers of 100 mm and 150 mm diameter[2] |
| Supported wafer materials | — | Opaque wafers (silicon, SOI) and transparent wafers (glass, fused-silica, sapphire)[2] |
| Photoresists available | — | AZ ECI 3007, AZ ECI 3027, AZ 10XT-20, AZ 10XT-60, AZ 15nXT, AZ 40XT[2] |
| Wafer diameter supported | — | 100mm and 150mm (on request)[2] |
| Wafer types | — | Opaque (silicon, SOI) and transparent (glass, fused-silica, sapphire)[2] |
| Number of spin-coating modules | — | 2[2] |
| Number of development modules | — | 1[2] |
| Number of hotplates | — | 9 (total across two stacks)[2] |
| Number of coolplates | — | 3[2] |
| HMDS priming module | — | Yes (included)[2] |
| Robot model | — | Sankyo SC5000[2] |
| Photoresist type | — | i-line[2] |
| Voltage | — | 400 V[3] |
| Phase | — | 3 Phase[3] |
| Frequency | — | 60 Hz[3] |
| Thermal modules | — | Two stacks of hotplates (9 in total) and coolplates (3 in total), including an additional HMDS-priming module[2] |
| Wafer material | — | Opaque wafers (silicon, SOI) and transparent wafers (glass, fused-silica, sapphire)[2] |
| Central robot | — | Individual processing modules are fed by a central robot[2] |
| Robot | — | central robot feeding the individual processing modules[2] |
| Supported wafer diameters | — | 100 mm and 150 mm diameter[2] |
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