Waferpedia

Comparison ledger

MA-4versus808

Karl Suss MA-4, OAI 808, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
MA-4Karl Suss
808OAI
OEMKarl SussOAI
CategoryLithographyLithography
Wafer size100mm100mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyKarl Suss MA-4OAI 808
Specifications
OEMKarl Suss[1]—
ModelMA-4[1]OAI 808 Aligner[2]
Equipment typeMask Aligner[1]—
Substrate sizeUp to 4" (100mm) in diameter[1]—
Sample compatibilityWorks for smaller samples[1]—
Alignment modeContact/proximity aligner[1]—
Illumination wavelengths365 nm or 405 nm[1]—
Backside alignmentReal-time infrared through-wafer backside alignment[1]—
Type—semi-automated, four-camera, optical front- and backside mask aligner[2]
Motorized features—motorized backside focus, motorized auto leveling, auto gap setting[2]
Size—2", 100mm, 150mm, 200mm pieces[2]
Mask size—4"x4"; 5"x5", 7"x7", and 9"x9"[2]
Top side alignment accuracy—± 1.0µm 3σ[2]
Bottom side alignment accuracy—± 1.25µm 3σ[2]
Large gap alignment accuracy—Option / ± 1.5µm 3σ[2]
Resolution—Vacuum + Hard Contact ≤ 1 µm; Hard Contact ≤ 1.5 µm; Soft Contact ≤ 2.0 µm; Proximity ≥ 3.0 µm[2]
Exposure wavelength—350 · ´50 nm[2]
Mercury arc lamp—350 W[2]
Description—Semi-automated, four-camera, optical front- and backside mask aligner[3]
Alignment accuracy—Top side alignment: ± 1.0µm 3σ; bottom side alignment: ± 1.25µm 3σ; large gap alignment: option / ± 1.5µm 3σ[2]
Lamp—Mercury arc lamp, 350 W[2]
Supported substrate sizes—5 mm to 200 mm[2]
Thickness—0.1–10 mm[2]

Plan your fab

Building a Lithography process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]nanocenter.umd.edunanocenter.umd.edu
  2. [2]cores.research.asu.educores.research.asu.edu
  3. [3]cores.research.asu.educores.research.asu.edu