Comparison ledger
Hitachi HS 9050, TEGAL 211, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | HS 9050Hitachi | 211TEGAL |
|---|---|---|
| OEM | Hitachi | TEGAL |
| Category | Resist Processing | Resist Processing |
| Wafer size | Mini-Environment Wafer Loading Module (EFEM) | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Hitachi HS 9050 | TEGAL 211 |
| Specifications | ||
| Configuration | Multi-chamber[1] | — |
| Wafer size | Mini-Environment Wafer Loading Module (EFEM)[1] | — |
| Centering Unit | V-notch alignment and centering[1] | — |
| Make | Hitachi[1] | — |
| Model | HS 9050[1] | — |
| Tool type | Asher[1] | — |
| Wafer loading module | Copper Mini-Environment Wafer Loading Module (EFEM)[1] | — |
| Load ports | 3 ea 25-wafer FOUP-capable load ports with N2 purge[1] | — |
| Robot | Four Axis Robot[1] | — |
| Chamber count | 7 chamber tool[1] | — |
| Ashing units | Five (5) Ashing Units[1] | — |
| Source unit | Lambda Source Unit[1] | — |
| Capacitance manometer | 722B11TCD2FA[1] | — |
| RF power supply | AXG-5000Ⅲ-27M-KE[1] | — |
| EPD | Multi-wavelength EPD, 0.1s sampling (Spectrometer)[1] | — |
| MFC #N | N2 Max Flow 20 L/min[1] | — |
| MFC #1 | O2 Max Flow 20 L/min[1] | — |
| MFC #2 | Ar Max Flow 20 L/min[1] | — |
| MFC #3 | H2 Max Flow 5 L/min[1] | — |
| MFC #4 | N2 Max Flow 20 L/min[1] | — |
| MFC #5 | CF4 Max Flow 1 L/min[1] | — |
| MFC #6 | CO2 Max Flow 0.4 L/min[1] | — |
| MFC #7 | He Max Flow 20 L/min[1] | — |
| MFC #8 | Without gasline, without MFC[1] | — |
| MFC #9 | Without gasline, without MFC[1] | — |
| MFC #10 | Without gasline, without MFC[1] | — |
| Cooling units | Two (2) Cooling Units[1] | — |
| Refurbished RTP RTA | — | AG Associates 4100, 4108, 8108, 8800, 8800i,210, 310, 410, 610, 610I, MPT RTP-600S, 800S, RTP-3000[2] |
| KLA-Tencor Spare Parts and Service | — | RS-35C,RS-55,RS-75,RS-100,UV-1050,UV-1080,UV-1250,UV-1280,ASET F5 / F5X,AIT Systems,HRP-220 Stylus Profiler[2] |
| Refurbished Isotropic Plasma Etcher | — | Matrix, Tegal, Lam Research, Branson/IPC, PlasmaTherm[2] |
| Refurbished PECVD, ALD Equipment | — | Cambridge, Oxford PlasmaLab , Plasma-Therm, STS/SPTS, AMAT[2] |
| Refurbished Mask Aligner | — | Canon Neutronix PLA501/545, Suss MA200CC, MA8BA8 GEN3, MA8BA8 GEN2, MA8BA8, MA200E[2] |
| Refurbished Bonding | — | SUSS SB6E, SUSS SB8E, EVG 620 BA, EVG EV501, West Bond 7200AR 7400A[2] |
| Refurbished Wafer Prober | — | Electroglas EG 4090u+, EG 4090, EG 2001X, EG 1034X, Cascade PS-21[2] |
| Process Type | — | Plasma Asher/Etcher[3] |
| Wafer Size (max) | — | 3 inch[3] |
| Form Factor | — | Table top[3] |
| Chamber Material | — | Aluminum[2] |
| Chamber Internal Dimensions | — | 6 x 6 x 3.75 inches[2] |
| Timer Range | — | 0-99 minutes[3] |
Plan your fab
Building a Resist Processing process? Get a complete equipment list.
Open the fab equipment planner →