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Comparison ledger

1305 BSG 3versusSS W 80 A-AR

Hitachi 1305 BSG 3, SCREEN SS W 80 A-AR, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1305 BSG 3Hitachi
OEMHitachiSCREEN
CategoryWet Processing / CleanWet Processing / Clean
Wafer size—200mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyHitachi 1305 BSG 3SCREEN SS W 80
Specifications
Configuration—Fully upgraded DNS SS-W80A-AR:[1]
Wafer size—200mm Notch Standard Silicon Wafer Substrate (Left to Right wafer flow)[1]
Make—SCREEN / DNS[1]
Model—SS W 80 A-AR[1]
Wafer Sizes—8 inch[1]
Scrubbing Units—2 front, 2 back side[1]
Reverse Units—2[1]
DI Water Rinse—Included[1]
Back Rinse—Included[1]
Brush Rinse—Included[1]
Nano DIW with N2—Included[1]
Wafer substrate—200mm notch standard silicon wafer substrate[1]
Communication—SECS II or GEM included[1]
Wafer log tracking—Real time wafer log tracking system per each wafer[1]
Auto back-up system—Included[1]
Recipe processing—Wafer level recipe processing; multi recipe/job processing per cassette (max 25 recipes per 1 cassette)[1]
Automatic wafer collection feature—Included[1]
Auto teaching feature—Included[1]

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Sources (1)Every fact above is drawn from these public sources
  1. [1]inventory listing