Waferpedia

Comparison ledger

1707 EXL Reflow SolderingversusUP 2000 A

Heller 1707 EXL Reflow Soldering, Speedline UP 2000 A, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
UP 2000 ASpeedline
OEMHellerSpeedline
CategoryAssembly / SMTAssembly / SMT
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
Family—Speedline UP 2000 A
Specifications
MakeHeller[1]Speedline / MPM[3]
Model1707 EXL[1]UP 2000 A[3]
Machine typeReflow soldering machine / reflow soldering oven[1]—
Vintage2005[1]—
Power inputStandard 208/240 VAC 3-phase[2]—
Breaker size100 amps @ 480 V[2]—
Optional power inputs380/400/440/415/480 VAC[2]—
Frequency50/60 Hz[2]60 Hz[3]
Overall length134 in (340 cm)[2]—
Overall width54 in (137 cm)[2]—
Overall height63 in (160 cm)[2]—
Typical net weight3000 lbs (1360 kg)[2]—
Operating systemWindows XP[2]—
Top heating zones7[2]—
Bottom heating zones7[2]—
Cooling zones1[2]—
Heater typeInstant response open coil[2]—
Heater materialNichrome[2]—
Temperature range25-350°C standard; high temperature up to 450°C optional[2]—
Maximum conveyor speed74 in/min (188 cm/min)[2]—
Configuration—Ultraprint 2000 series[3]
Equipment type—Screen Printer[3]
Series—Ultraprint 2000 series[3]
Power & electrical—V 115/60 - Hz 3-A[3]
Supply voltage—115 V[3]
Phase—3-Phase[3]

Plan your fab

Building a Assembly / SMT process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]efsmt.comefsmt.com
  3. [3]inventory listing