Comparison ledger
EV Group EVG 150, OAI 808-Aligner-Tool-Procedu, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | EVG 150EV Group | |
|---|---|---|
| OEM | EV Group | OAI |
| Category | Lithography | Lithography |
| Wafer size | 100mm | 100mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | i-line | — |
| Family | EV Group EVG 150 | OAI 808-Aligner-Tool-Procedu |
| Specifications | ||
| Tool type | Modular cluster tool for coating and development of i-line photoresists[1] | — |
| Loading/unloading ports | Two loading/unloading ports: one cassette for coating and one cassette for development[1] | — |
| Wafer centering | Optical wafer centering station[1] | — |
| Spin-coating modules | Three spin-coating modules: coater A, coater B, and coater C[1] | — |
| Coater A use | Low-viscosity photoresist[1] | — |
| Coater B use | High-viscosity photoresist[1] | — |
| Coater C use | Bottom layers[1] | — |
| Development module | One development module with puddle and spray options[1] | — |
| Hotplates and coolplates | Three stacks of hotplates (8 in total) and coolplates (3 in total)[1] | — |
| HMDS priming | Additional HMDS-priming module[1] | — |
| Robot | Dual end effector robot[1] | — |
| Wafer handling | Standard SEMI-wafers of 100 mm and 150 mm diameter[1] | — |
| Substrate types | Opaque wafers (silicon, SOI) or transparent wafers (glass, fused-silica, sapphire)[1] | — |
| Process stability features | Airborne molecular contamination (AMC) filter and active control of chamber and resist/developer lines temperature[1] | — |
| Available photoresists | AZ ECI 3007, AZ ECI 3027, AZ 1512 HS, AZ nLOF 2020, AZ nLOF 2070, MC PC62E[1] | — |
| Available bottom layers | LOR 5A, LOR 15C, XHRiC-16 II[1] | — |
| Surface preparation options | HMDS, dehydrate, or none[1] | — |
| Solvent clean options | Standard or edge bead removal (EBR)[1] | — |
| Developer chemistries | AZ 726 MIF, AZ 400K 1:3.5, AZ developer III[1] | — |
| wafer diameter | 100mm and 150mm[1] | — |
| loading/unloading ports | Two (one cassette for coating, one for development)[1] | — |
| wafer centering station | Optical wafer centering station[1] | — |
| spin-coating modules | Three (coater A: low-viscosity PR, coater B: high-viscosity PR, coater C: bottom layers)[1] | — |
| development module | One, with both puddle and spray options[1] | — |
| hotplates | Three stacks, 8 in total[1] | — |
| coolplates | Three stacks, 3 in total[1] | — |
| additional module | HMDS-priming module[1] | — |
| wafer types | Opaque (silicon, SOI) or transparent (glass, fused-silica, sapphire)[1] | — |
| process enhancement | AMC filter and active control of chamber and resist/developer line temperature[1] | — |
| Wafer sizes | 100mm and 150mm diameter[1] | — |
| Loading ports | Two loading/unloading ports[1] | — |
| Hotplates | Three stacks, 8 total[1] | — |
| Coolplates | Three total[1] | — |
| HMDS-priming module | Included[1] | — |
| Wafer types | Opaque (silicon, SOI) and transparent (glass, fused-silica, sapphire)[1] | — |
| AMC filter | Airborne molecular contamination filter on top[1] | — |
| Temperature control | Active control of chamber and resist/developer lines temperature[1] | — |
| Photoresists available | AZ ECI 3007, AZ ECI 3027, AZ 1512 HS, AZ nLOF 2020, AZ nLOF 2070, MC PC62E; bottom layers: LOR 5A, LOR 15C, XHRiC-16[1] | — |
| Wafer size | 100mm and 150mm[1] | — |
| Photoresist type | i-line[1] | — |
| Process enhancement | Airborne molecular contamination filter and active control of chamber and resist/developer line temperature[1] | — |
| Priming module | Additional HMDS-priming module[1] | — |
| Wafer diameter | 100 mm and 150 mm diameter[1] | — |
| Model | — | OAI Model 800 Mask Aligner[2] |
| Automation | — | Semi-automated[2] |
| Camera count | — | Four-camera[2] |
| Alignment type | — | Optical front- and backside mask aligner[2] |
| Alignment accuracy | — | 1 µm to 2 µm[2] |
| Backside focus | — | Motorized[2] |
| Auto leveling | — | Motorized[2] |
| Gap setting | — | Auto gap setting[2] |
| Supported piece size | — | 2", 100mm, 150mm, 200mm, pieces[2] |
| Thickness range | — | 0.1–10 mm[2] |
| Mask size | — | 4"x4"; 5"x5"; 7"x7"; 9"x9"[2] |
| Top side alignment | — | ± 1.0 µm 3σ[2] |
| Bottom side alignment | — | ± 1.25 µm 3σ[2] |
| Large gap alignment | — | Option / ± 1.5 µm 3σ[2] |
| Resolution | — | Vacuum + Hard Contact ≤ 1 µm; Hard Contact ≤ 1.5 µm; Soft Contact ≤ 2.0 µm; Proximity ≥ 3.0 µm[2] |
| Exposure wavelength | — | 350–450 nm[2] |
| Lamp | — | Mercury arc lamp, 350 W[2] |
| Type | — | semi-automated, four-camera, optical front- and backside mask aligner[2] |
| Motorized backside focus | — | yes[2] |
| Motorized auto leveling | — | yes[2] |
| Auto gap setting | — | yes[2] |
| Size | — | 2 in, 100 mm, 150 mm, 200 mm[2] |
| Thickness | — | 0.1-10 mm[2] |
| Mercury arc lamp | — | 350 W[2] |
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