Comparison ledger
EV Group 620 BA, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 620 BAEV Group | 10490West Bond |
|---|---|---|
| OEM | EV Group | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | EV Group 620 BA | West Bond 10490 |
| Specifications | ||
| Alignment method | Backside alignment, transparent alignment, IR alignment (optional)[1] | — |
| Backside alignment accuracy | ±2 µm (3σ)[1] | — |
| Transparent alignment accuracy | ±1 µm (3σ)[1] | — |
| Wafer sizes | 2", 3", 100 mm, 150 mm[1] | — |
| Wafer thickness | 0.1 - 10 mm[1] | — |
| Max stack height | 10 mm[1] | — |
| Configuration | Desktop with optional system rack[1] | — |
| Vibration isolation | Passive[1] | — |
| Alignment stage | Manual precision micrometers, optional motorized, automated wedge compensation[1] | — |
| Microscopes | Fully motorized high-resolution bottom-side microscopes[1] | — |
| User interface | Windows-based[1] | — |
| Handling | Standard 3 cassette stations, optional up to 5 stations[1] | — |
| Automatic alignment | Optional[1] | — |
| Manufacturer | — | West Bond[2] |
| Model | — | 10490[2] |
| Description | — | Convertible bonder, wedge to ball[3] |
| Tool type | — | Convertible bonder[4] |
| Bonding modes | — | Wedge bonding and ball bonding[4] |
| Use | — | Wire bonding[4] |
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