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120 Automated Coater ProcessingversusAct 12 DUV Photoresist Coater Developer Track

EV Group 120 Automated Coater Processing, Tokyo Electron Act 12 DUV Photoresist Coater Developer Track, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMEV GroupTokyo Electron
CategoryResist ProcessingResist Processing
Wafer size—The direction of wafer flow is right to left
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyEV Group 120 Automated Coater ProcessingTokyo Electron Act 12
Specifications
Configuration50/60 Hz[1]Type 4 Main controller[2]
Phase3 Phase[1]—
Wafer sizes6 inch, 8 inch[1]—
Frequency50/60 Hz[1]—
Wiring configuration4 Wire + GND[1]—
Vintage2015[1]2009[2]
Wafer size—The direction of wafer flow is right to left[2]
OEM—Tokyo Electron[2]
Model—Act 12 DUV Photoresist Coater / Developer Track[2]
Category—Resist Processing[2]
Wafer flow direction—right to left[2]
Main controller—Type 4[2]
Load ports—4 FOUP load ports for 12 inch wafers[2]
COT units—2[2]
BARC units—2[2]
DEV units—4[2]
WEE unit—1[2]
ADH units—2[2]
Closed loop T&H system—Included[2]
IFB—for wafer transport system NIKON NSR-S204B[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing