Comparison ledger
EV Group 101, Tokyo Electron Act 8 I-Line Track, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 101EV Group | Act 8 I-Line TrackTokyo Electron |
|---|---|---|
| OEM | EV Group | Tokyo Electron |
| Category | Lithography | Lithography |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | 1999 |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | i-line |
| Family | EV Group 101 | Tokyo Electron Act |
| Cited variants | — |
|
| Specifications | ||
| OEM | EV Group[6] | — |
| Model | 101[6] | Act 8[1] |
| Equipment name | EVG 101 Spray Coater[6] | — |
| NEMO ID | evgspraycoat[6] | — |
| Training required | EVG 101 Training[6] | — |
| Training duration | 1.50 hours[6] | — |
| Processing technique | Resist Spray Coat (manual)[6] | — |
| Cleanliness | "All"[6] | — |
| Location | SNF Paul G Allen L107 Cleanroom[6] | — |
| Wafer diameter (substrate size) | up to 300 mm[7] | — |
| Available modules | Spin coat / OmniSpray® / develop[7] | — |
| Wafer handling options | Bowed / warped / thin wafer handling, edge handling[7] | — |
| Dispense options | Various resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[7] | — |
| Processing technique (at SNF) | Resist Spray Coat (manual)[8] | — |
| Cleanliness group (at SNF) | "All"[6] | — |
| Configuration | — | 1C/3D[1] |
| Make | — | Tel[1] |
| Wafer Size | — | 8 inch[1] |
| Vintage | — | 1999[1] |
| Generation | — | I-Line[1] |
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