Comparison ledger
EV Group 101, SUSS MicroTec MA 8 Mask, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 101EV Group | MA 8 MaskSUSS MicroTec |
|---|---|---|
| OEM | EV Group | SUSS MicroTec |
| Category | Lithography | Lithography |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | EV Group 101 | SUSS MicroTec MA 8 Mask |
| Cited variants | — | |
| Specifications | ||
| OEM | EV Group[4] | SUSS[3] |
| Model | 101[4] | MA 8[3] |
| Equipment name | EVG 101 Spray Coater[4] | — |
| NEMO ID | evgspraycoat[4] | — |
| Training required | EVG 101 Training[4] | — |
| Training duration | 1.50 hours[4] | — |
| Processing technique | Resist Spray Coat (manual)[4] | — |
| Cleanliness | "All"[4] | — |
| Location | SNF Paul G Allen L107 Cleanroom[4] | — |
| Wafer diameter (substrate size) | up to 300 mm[5] | — |
| Available modules | Spin coat / OmniSpray® / develop[5] | — |
| Wafer handling options | Bowed / warped / thin wafer handling, edge handling[5] | — |
| Dispense options | Various resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[5] | — |
| Processing technique (at SNF) | Resist Spray Coat (manual)[6] | — |
| Cleanliness group (at SNF) | "All"[4] | — |
| Configuration | — | Gen 2[3] |
| Light Source | — | Full spectrum lamp[3] |
| Wafer size | — | 8 inch[3] |
| Optical sensor wavelengths | — | 405 nm and 365 nm[3] |
| Equipment type | — | Mask Aligner[3] |
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