Comparison ledger
EV Group 101, SUSS MicroTec MA 150 E Mask, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 101EV Group | MA 150 E MaskSUSS MicroTec |
|---|---|---|
| OEM | EV Group | SUSS MicroTec |
| Category | Lithography | Lithography |
| Wafer size | — | Wafer Thickness Measurement |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | EV Group 101 | SUSS MicroTec MA 150 |
| Specifications | ||
| OEM | EV Group[1] | SUSS[4] |
| Model | 101[1] | MA 150 E[4] |
| Equipment name | EVG 101 Spray Coater[1] | — |
| NEMO ID | evgspraycoat[1] | — |
| Training required | EVG 101 Training[1] | — |
| Training duration | 1.50 hours[1] | — |
| Processing technique | Resist Spray Coat (manual)[1] | — |
| Cleanliness | "All"[1] | — |
| Location | SNF Paul G Allen L107 Cleanroom[1] | — |
| Wafer diameter (substrate size) | up to 300 mm[2] | — |
| Available modules | Spin coat / OmniSpray® / develop[2] | — |
| Wafer handling options | Bowed / warped / thin wafer handling, edge handling[2] | — |
| Dispense options | Various resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[2] | — |
| Processing technique (at SNF) | Resist Spray Coat (manual)[3] | — |
| Cleanliness group (at SNF) | "All"[1] | — |
| Configuration | — | Gen 2[4] |
| Wafer size | — | Wafer Thickness Measurement[4] |
| Prealigner Type | — | XRS[5] |
| Operating System | — | Windows 2000[5] |
| Lamphouse | — | 1000 Watt Lamphouse[5] |
| Exposure Optics | — | UV400 Optics (365nm/405nm exposure)[5] |
| Power Supply | — | CIC1200[5] |
| Microscope | — | DVM6 Microscope[5] |
| Single Objective | — | Configured to fit customer requirement (5x, 10x, or 20x)[5] |
| Vacuum Chuck | — | Configured to fit customer requirements[5] |
| Maskholder | — | Configured to fit customer requirements[5] |
| Equipment type | — | Mask Aligner[4] |
| Equipped with | — | Wafer Thickness Measurement[4] |
| Alignment mode | — | Topside Alignment (TSA)[5] |
| Operation mode | — | Automatic or Manual Mode[5] |
| Cassette operation | — | Cassette to cassette operation[5] |
| Alignment system | — | AL3000 Automatic Alignment[5] |
| Pattern recognition software | — | Cognex 8100 Pattern Recognition Software[5] |
| Exposure modes | — | Hard, Soft, Proximity, and Vacuum Contact Exposure Modes[5] |
| System power | — | 208/230V[5] |
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