Waferpedia

Comparison ledger

R07versus15

Disco R07, Lapmaster 15, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
R07Disco
15Lapmaster
OEMDiscoLapmaster
CategoryDicing & GrindingDicing & Grinding
Wafer sizeup to Φ8”—
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco R07Lapmaster 15
Cited variants
  • R07-SDC600-BB101-75[1]
  • R07-SD400-BB200-75[1]
  • R07-SDC400-BB300-75[1]
  • R07-SDC400-BB500-75[1]
—
Specifications
ModelDAD3241[2]—
Max. workpiece sizeΦ8”[2]—
X-/Y-axis cutting range210 mm[2]—
Cutting speed0.1-800 mm/s[2]—
Index positioning accuracy0.002/210 mm[2]—
Z-axis max. stroke32.2 mm[2]—
Moving resolution0.000002 mm[2]—
Repeatability accuracy0.001 mm[2]—
Θ-axis max. rotating angle320°[2]—
Rotation speed range6,000-60,000 rpm[2]—
Spindle power1.8 kW[2]—
TypeResin bond blades[1]—
ApplicationsGlass, quartz, ceramics, etc.[1]—
Major usesGlass (borosilicate glass, non-alkali glass), crystal, ceramics, QFN, metal, quartz, alumina, LTCC, aluminum nitride[1]—
Wafer sizeup to Φ8”[2]—
Input Power—110 Vac[3]
Plate Diameter—15 inches (381 mm)[4]
Number of Conditioning Rings—3[4]
Ring ID—5.5 inches (140 mm)[4]
Standard RPM—60[4]
RPM Range (Variable Speed Drive)—0-60[4]
Drive Motor - Lapper—0.5 HP (0.37 kW)[4]
Drive Motor - Polisher—0.75 HP (0.56 kW)[4]
Length—25 inches (635 mm)[4]
Width—20 inches (508 mm)[4]
Height—24 inches (610 mm)[4]
Estimated Shipping Weight—285 lbs (129.3 kg)[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]disco.co.jpdisco.co.jp
  2. [2]aggiefab.tamu.eduaggiefab.tamu.edu
  3. [3]inventory listing
  4. [4]web.archive.orgweb.archive.org