Waferpedia

Comparison ledger

DFG 8560versus15

Disco DFG 8560, Lapmaster 15, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
15Lapmaster
OEMDiscoLapmaster
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DFGLapmaster 15
Specifications
Phase3 Phase[1]—
Voltage200V[1]—
Configuration3 Wire + 2 Ground[1]—
Spindle TypeAir Bearings[1]—
External CoolingWater Cooled[1]—
Frequency50 / 60 Hz[2]—
Full Load Amps57 A[2]—
Maximum workpiece size300 mm[3]—
Number of spindles2[3]—
Spindle power (Z1-Z3)4.8 kW[3]—
Spindle speed (Z1-Z3)1,000 - 4,000 min⁻¹[3]—
Number of work tables3[3]—
Dimensions (WxDxH)1,400 x 3,322 x 1,800 mm[3]—
Weightapprox. 4,000 kg[3]—
Full load amperage57 A[1]—
Machine typeGrinder[1]—
Wiring3 Wire + 2 Ground[1]—
ChillerDisco DTU 152[1]—
OEMDisco[1]—
ModelDFG 8560[1]—
CategoryDicing & Grinding[3]—
AutomationFully automatic[3]—
Spindle count2[3]—
Work table count3[3]—
Power200 VAC, 3 phase, 50/60 Hz, 57 A[2]—
Vintage2011[1]—
Input Power—110 Vac[4]
Plate Diameter—15 inches (381 mm)[5]
Number of Conditioning Rings—3[5]
Ring ID—5.5 inches (140 mm)[5]
Standard RPM—60[5]
RPM Range (Variable Speed Drive)—0-60[5]
Drive Motor - Lapper—0.5 HP (0.37 kW)[5]
Drive Motor - Polisher—0.75 HP (0.56 kW)[5]
Length—25 inches (635 mm)[5]
Width—20 inches (508 mm)[5]
Height—24 inches (610 mm)[5]
Estimated Shipping Weight—285 lbs (129.3 kg)[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]web.archive.orgweb.archive.org
  4. [4]inventory listing
  5. [5]web.archive.orgweb.archive.org