Waferpedia

Comparison ledger

DFD 6341versus15

Disco DFD 6341, Lapmaster 15, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
15Lapmaster
OEMDiscoLapmaster
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DFD 6341Lapmaster 15
Specifications
Phase3 Phase[1]—
Configuration380-415 Voltage[1]—
Electrical Phase3 Phase[1]—
Supply Voltage380-415 V[1]—
Wiring Configuration3 Wire + Ground[1]—
Frequency50/60 Hz[1]—
Vintage (Year of Manufacture)2017[1]—
OEMDisco[1]—
ModelDFD 6341[1]—
Equipment typeDicer[1]—
Power3 phase[1]—
Voltage380-415 Voltage[1]—
Electrical connection3 Wire + Ground[1]—
Vintage2017[1]—
Input Power—110 Vac[3]
Plate Diameter—15 inches (381 mm)[4]
Number of Conditioning Rings—3[4]
Ring ID—5.5 inches (140 mm)[4]
Standard RPM—60[4]
RPM Range (Variable Speed Drive)—0-60[4]
Drive Motor - Lapper—0.5 HP (0.37 kW)[4]
Drive Motor - Polisher—0.75 HP (0.56 kW)[4]
Length—25 inches (635 mm)[4]
Width—20 inches (508 mm)[4]
Height—24 inches (610 mm)[4]
Estimated Shipping Weight—285 lbs (129.3 kg)[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]Equipment inventory listing
  3. [3]inventory listing
  4. [4]web.archive.orgweb.archive.org