Comparison ledger
Disco DCS1440, Laurell EDC-650, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | DCS1440Disco | EDC-650Laurell |
|---|---|---|
| OEM | Disco | Laurell |
| Category | — | — |
| Wafer size | 100mm | 100mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DCS1440 | Laurell EDC-650 |
| Specifications | ||
| Mentioned function | atomizing cleaning[1] | — |
| Associated equipment | DAG810 automatic surface grinder[1] | — |
| Maximum workpiece size | Φ8 inch[2] | — |
| Application frame | 2-8-1[3] | — |
| Table RPM | 100 to 3,000 min⁻¹[2] | — |
| Setting time for cleaning/drying | 0 to 999 sec[2] | — |
| Cleaning nozzle speed | 1 to 37.5 °/sec[2] | — |
| Cleaning range | Φ365 mm (up to 250×250 mm)[2] | — |
| Cleaning pressure range | 2.3 to 11.8 MPa[2] | — |
| Equipment dimensions (W×D×H) | 400 × 600 × 1,220 mm[2] | — |
| Dry mass | Approx. 124 kg[2] | — |
| Maximum square workpiece (optional) | 250×250 mm[2] | — |
| Model | — | EDC-650[4] |
| Equipment name in source | — | Laurell EDC-650 Spin Processor #2 (Primary Litho)[4] |
| Wafer handling | — | Unclamped pieces (mounted on carrier wafer), 100 mm round wafers, 150 mm round wafers, 100 mm × 100 mm square wafers[4] |