Comparison ledger
Disco 3220, Disco KR15, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 3220Disco | KR15Disco |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | 8" |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco 3220 | Disco KR15 |
| Cited variants | — |
|
| Specifications | ||
| equipment type | dicing saw[2] | — |
| Workplace size | ø150 mm[3] | — |
| Spindle layout | Single[3] | — |
| Spindle output | 1.5 kW at 30,000 min-1[3] | — |
| Spindle max revolution speed | 40,000 min-1[3] | — |
| X-axis feed speed range | 0.1 – 500 mm/s[3] | — |
| Y-axis index step | 0.0001 mm[3] | — |
| Z-axis repeating accuracy | 0.001 mm[3] | — |
| Z-axis max blade size | ø58 mm[3] | — |
| Blade designation | — | Disco KR15[4] |
| Blade thickness | — | 200 micron[4] |
| Blade grit | — | low grit[4] |
| Intended materials | — | sapphire, glass, and silicon[4] |
| Max. workpiece size | — | Φ8"[4] |
| Thickness | — | 200 micron[4] |
| Grit | — | Low grit[4] |
| Materials | — | sapphire, glass, and silicon[4] |
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