Comparison ledger
Disco 321, Kulicke & Soffa 782-6, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 321Disco | 782-6Kulicke & Soffa |
|---|---|---|
| OEM | Disco | Kulicke & Soffa |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | 6" |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco 321 | Kulicke & Soffa 782-6 |
| Specifications | ||
| OEM | Disco[1] | — |
| Model | 321[1] | — |
| Equipment type | Wafer Dicing Saw[1] | — |
| Facility context | Cleanroom Instrumentation[1] | — |
| Application area | Nano and Micro Fabrication[1] | — |
| Location | FNT 4.106[1] | — |
| Wafer Size | Up to 6 inches[2] | — |
| Spindle Power | 1.0 kW Synchro Spindle (or 1.5 kW Synchro Spindle in some configurations)[3] | — |
| Spindle Power (alternate) | 1500 Watt spindle[2] | — |
| Non-Contact Setup | Non Contact Setup[3] | — |
| Microscope | Microscope With Eyepiece and Shutter (or Dual Objective Microscope With Eyepiece)[3] | — |
| Broken Blade Detection | Broken Blade Detection[3] | — |
| Light Tower | Includes Light Tower[3] | — |
| Chuck Type | 6" Universal Chuck (or 6" Porous Film Frame Chuck)[2] | — |
| Wafer size capability | Up to 6" wafers[3] | — |
| Chuck | 6-inch porous film frame chuck[2] | — |
| Spindle power | 1500-watt spindle[2] | — |
| Footprint | Small footprint[2] | — |
| Setup | Non-contact setup[3] | — |
| Blade break detection | Broken blade detection[3] | — |
| Other features | Floppy drive, light tower, blade tools, manuals[3] | — |
| Maximum wafer size | — | up to 6" wafers[4] |
| Maximum wafer thickness | — | 800 µm thick[4] |
| Materials diced | — | Si, Glass, Quartz, SiC, Sapphire, LiNbO3[4] |
| Kerf width | — | down to 50 µm (blade dependent)[4] |
| Blade cooling and rinsing | — | DI water[4] |
| Category | — | Dicing & Grinding[5] |
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