Comparison ledger
Disco 321, Disco DFL 7560 L, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 321Disco | DFL 7560 LDisco |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | Robot Wafer handling |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco 321 | Disco DFL |
| Cited variants | — |
|
| Specifications | ||
| OEM | Disco[2] | — |
| Model | 321[2] | — |
| Equipment type | Wafer Dicing Saw[2] | — |
| Facility context | Cleanroom Instrumentation[2] | — |
| Application area | Nano and Micro Fabrication[2] | — |
| Location | FNT 4.106[2] | — |
| Wafer Size | Up to 6 inches[3] | — |
| Spindle Power | 1.0 kW Synchro Spindle (or 1.5 kW Synchro Spindle in some configurations)[4] | — |
| Spindle Power (alternate) | 1500 Watt spindle[3] | — |
| Non-Contact Setup | Non Contact Setup[4] | — |
| Microscope | Microscope With Eyepiece and Shutter (or Dual Objective Microscope With Eyepiece)[4] | Low and High Magnification microscope with LED illumination[1] |
| Broken Blade Detection | Broken Blade Detection[4] | — |
| Light Tower | Includes Light Tower[4] | — |
| Chuck Type | 6" Universal Chuck (or 6" Porous Film Frame Chuck)[3] | — |
| Wafer size capability | Up to 6" wafers[4] | — |
| Chuck | 6-inch porous film frame chuck[3] | — |
| Spindle power | 1500-watt spindle[3] | — |
| Footprint | Small footprint[3] | — |
| Setup | Non-contact setup[4] | — |
| Blade break detection | Broken blade detection[4] | — |
| Other features | Floppy drive, light tower, blade tools, manuals[4] | — |
| Wafer size | — | Robot Wafer handling[1] |
| Wafer | — | Can be modified at later date to 3”, 4” & 6” wafers and frame[1] |
| Configuration | — | Operation by touch panel LCD monitor[1] |
| Uninterruptible Power Supply | — | 1[1] |
| Wafer Sizes (standard) | — | 2, 3, 4 inch[1] |
| Wafer Size Modification | — | Can be modified to 3”, 4” & 6” wafers and frame[1] |
| Maximum Workpiece Size | — | ø150 mm[5] |
| Processing Mode | — | Fully automatic[5] |
| Dimensions (W x D x H) | — | 2,000 x 1,810 x 1,800 mm[5] |
| Weight | — | approx. 3,300 kg[5] |
| Robot Wafer Handling | — | Yes[1] |
| Operation Interface | — | Touch panel LCD monitor[1] |
| Power Supply | — | Step-down Transformer 400 V, 3 phases, 50 Hz[1] |
| CE Marking | — | Yes[1] |
| Axis Control | — | X and Y axis with linear scale closed loop control[1] |
| Laser Cooling | — | Laser power supply with built in water cooled chillers[1] |
| Additional Chiller | — | Chiller unit to supply cooling water for Laser power supply[1] |
| X Axis Chiller | — | Chiller unit to supply cooling water to X axis[1] |
| Z Axis Positional Repeatability | — | 0.002 mm[1] |
| Optional Upgrade | — | 200 mm Fully Automatic wafer handling from/to standard wafer cassette, Chuck for 200mm wafers, New robot design for handling heavier wafers, 6 inch Lens and new Galvo Scanner[1] |
Plan your fab
Building a Dicing & Grinding process? Get a complete equipment list.
Open the fab equipment planner →