Waferpedia

Comparison ledger

03 iX AutomaticversusSiplace HS 60

Dek 03 iX Automatic, Siemens Siplace HS 60, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMDekSiemens
CategoryAssembly / SMTAssembly / SMT
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDek 03 iX AutomaticSiemens Siplace HS 60
Specifications
Vintage2020[1]—
Configuration—4 x DLM2 gantries[2]
Machine type—pick-and-place machine[2]
Changeover tables—4 changeover tables[2]
Placement speed—60,000 cph[3]
Component range—0.6 mm x 0.3 mm (0201) to 18.7 mm x 18.7 mm[3]
Maximum placement accuracy—80/75 μm (4 sigma)[3]
PCB dimensions, single conveyor—50 mm x 50 mm to 368 mm x 216 mm[4]
PCB dimensions, dual conveyor—50 mm x 50 mm to 368 mm x 460 mm[4]
Feeding capacity—144 tracks, 8 mm tape[4]
Operating system—Microsoft Windows / RMOS[3]
Power—4 kW[3]
Compressed air requirements—5.5-10 bar, 950 Nl/min, pipe diameter 3/4[3]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]inventory listing
  3. [3]efsmt.comefsmt.com
  4. [4]vitapcb.comvitapcb.com