Waferpedia

Comparison ledger

1000 Hot PlateversusFI 20160 1 Microwave

CEE 1000 Hot Plate, MKS FI 20160 1 Microwave, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMCEEMKS
CategoryThermal / DiffusionThermal / Diffusion
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyCEE 1000 Hot PlateMKS FI 20160
Specifications
Configuration4"[1]20 A[2]
TypeHot Plate[1]—
Wafer Size4 inch[1]—
Phase—SmartPower series - 3.0 kW - Liquid-cooled - 200–208 VAC, 3-phase - Remote / DeviceNet control[2]
Voltage—208 V[2]
Power—3.0 kW[2]
Cooling—Liquid-cooled[2]
Current—20 A[2]
Frequency—50/60 Hz[2]
Control—Remote / DeviceNet[2]

Plan your fab

Building a Thermal / Diffusion process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing