Waferpedia

Comparison ledger

1000 Hot Plateversus788

CEE 1000 Hot Plate, Heller 788, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
788Heller
OEMCEEHeller
CategoryThermal / DiffusionThermal / Diffusion
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyCEE 1000 Hot PlateHeller 788
Specifications
Configuration4"[1]—
TypeHot Plate[1]—
Wafer Size4 inch[1]—
oven type—in-line, continuous cure, vertical format oven[2]
thermal zones—four internal thermal zones[2]
controls—independent time and temperature controls[2]
cycle time—as short as 25 seconds[2]
curing time—from a few minutes to several hours[2]
footprint—as small as 72 inches (183 cm)[2]
product width range—2 to 18 inches (5 to 46 cm)[2]
product thickness range—as thin as 0.015 inch (0.4 mm)[2]
atmosphere—air or nitrogen[2]
clean room compatibility—Class 1,000 or 10,000 clean room compatibility[2]
board support—center board support for ultra-thin boards[2]
conveyor width adjustability—adjustable from 2 to 18 inches (5 to 46 cm)[2]
pitch between product carriers—3/8 to 1 1/2 inches (9.5 to 38 mm) in 3/8-inch (9.5 mm) increments[2]
heating—forced convection heating[2]
interface—magazine loader interface[2]
software—Windows software[2]
standards—SMEMA compatibility; meets CE standards[2]
Cycle time (minimum)—25 seconds[2]
Curing time (maximum)—4 hours[2]
Footprint (minimum)—72 inches (183 cm)[2]
Height options—7, 8, 9, 10 feet (213, 244, 274, 305 cm)[2]
Number of thermal zones—4[2]
Clean room compatibility—Class 1,000 or 10,000[2]
Conveyor width range—2 to 18 inches (5-46 cm)[2]
Minimum product thickness—0.015 inch (0.4 mm)[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]web.archive.orgweb.archive.org