Waferpedia

Comparison ledger

103-754versusWL-210

Cascade Microtech 103-754, Signatone WL-210, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
103-754Cascade Microtech
WL-210Signatone
OEMCascade MicrotechSignatone
CategoryTest & ProbeTest & Probe
Wafer size6-inch diameter microchamber and thermal chuckup to 8-inch wafers
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyCascade Microtech 103-754Signatone WL-210
Cited variants—
Specifications
typex-y-z-θ probe positioner[2]—
installed onHFTL 50-GHz Small-Signal Probe Station[2]—
quantity in stationtwo[2]—
station chuck size6-inch-diameter microchamber and thermal chuck[2]—
Quantity per stationTwo positioners[2]—
Chuck size6-inch-diameter microchamber and thermal chuck[2]—
Temperature range-50 to 200 °C[2]—
Base—Massive 2" one-piece machined aircraft aluminum base for stability[1]
Platen—Large heavy-duty nickel steel platen with 4 point planar lift[1]
Positioning stage—Fast, accurate and repeatable compound X-Y stage for sub-micron positioning[1]
Wafer/substrate compatibility—Accepts shards through 8" wafers, substrates, PCB's, and ultra-thin wafers[1]
Platen control—Independent platen height (locking) and contact / separate control[1]
Chuck and stage assembly—Non-ferrous chuck and stage assembly reduces magnetic interference and crosstalk[1]
Micropositioner support—Supports bolt-down, vacuum, and magnetic base micropositioners[1]
Chuck biasing—Banana / BNC / Triax chuck biasing[1]
Probe card holder—Quick-Change probe card holder option with independent theta adjust[1]
Microscope—Tilt-back microscope provides unobstructed fixturing access[1]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]cnf.cornell.educnf.cornell.edu