Comparison ledger
Buehler PowerPro 3000, Lapmaster 12 Lapper, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | PowerPro 3000Buehler | 12 LapperLapmaster |
|---|---|---|
| OEM | Buehler | Lapmaster |
| Category | CMP | CMP |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Buehler PowerPro 3000 | — |
| Specifications | ||
| Configuration | Variable speed[1] | — |
| Type | Grinder/Polisher[1] | — |
| Speed control | Variable speed[1] | — |
| Outside plate diameter | — | 12 inches[2] |
| Lapping Speed Range | — | 0 to 60 rpm[3] |
| Wafer Size Compatibility | — | 4 inches or smaller[2] |
| Input Voltage | — | 110 V[2] |
| Frequency | — | 60 Hz[2] |
| Phase | — | 1[2] |
| Number of Rings | — | 3[2] |
| Number of Weights | — | 3[2] |
| Includes Slurry System | — | Yes[2] |
| Includes Timer | — | Yes[2] |