Comparison ledger
Bruker Dektak XT Stylus, KLA 1.112 PSL Wafer, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Dektak XT StylusBruker | |
|---|---|---|
| OEM | Bruker | KLA |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Bruker Dektak XT Stylus | KLA 1.112 PSL Wafer |
| Specifications | ||
| Stylus Force Range | 1 - 15 mg[1] | — |
| Tip Diameter | 12.5 µm[1] | — |
| Vertical Resolution | 1 Å max. (0.1 nm)[1] | — |
| Vertical Range | 1 mm (0.039 in.)[1] | — |
| Scan Length Range | 55 mm (2 in.)[1] | — |
| Step Height Repeatability | <5 Å, 1σ on 0.1 µm step[1] | — |
| Data Points Per Scan | 120,000 maximum[1] | — |
| Sample X/Y Stage | Manual 100 mm X/Y, manual leveling[1] | — |
| Maximum Sample Thickness | 50 mm (1.95 in.)[1] | — |
| Maximum Wafer Size | 200 mm (8 in.)[1] | — |
| Software | Vision 64[1] | — |
| Power Input | 100 - 240 VAC, 110 VA max[2] | — |
| Stylus Type | Diamond-tipped[2] | — |
| Measurement Principle | Electromechanical, LVDT[2] | — |
| Optional Stylus Tips | 2.0 µm and 12.5 µm radius[3] | — |
| Stylus Tip Radii Available | 2.0 μm and 12.5 μm[3] | — |
| Measurement Capability | 2D and 3D surface profiling[3] | — |
| Vintage | 2018[4] | — |
| Configuration | — | NIST Traceable[5] |
| Wafer Size | — | 8 inch[5] |
| NIST Traceable | — | True[5] |
| Compatible Tools | — | Surfscan 6xy0 and Sp1[6] |
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