Waferpedia

Comparison ledger

B2versus808-Aligner-Tool-Procedu

Brewer Science B2, OAI 808-Aligner-Tool-Procedu, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
B2Brewer Science
OEMBrewer ScienceOAI
CategoryLithographyLithography
Wafer size100mm100mm
Process nodeDUV—
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBrewer Science B2OAI 808-Aligner-Tool-Procedu
Specifications
TypeDevelopable BARC[1]semi-automated, four-camera, optical front- and backside mask aligner[2]
Name in ACT-8 process listB2 DUV42P[1]—
Configured wafer size on ACT-8100 mm (4") wafers[1]—
Model—OAI Model 800 Mask Aligner[2]
Automation—Semi-automated[2]
Camera count—Four-camera[2]
Alignment type—Optical front- and backside mask aligner[2]
Alignment accuracy—1 µm to 2 µm[2]
Backside focus—Motorized[2]
Auto leveling—Motorized[2]
Gap setting—Auto gap setting[2]
Supported piece size—2", 100mm, 150mm, 200mm, pieces[2]
Thickness range—0.1–10 mm[2]
Mask size—4"x4"; 5"x5"; 7"x7"; 9"x9"[2]
Top side alignment—± 1.0 µm 3σ[2]
Bottom side alignment—± 1.25 µm 3σ[2]
Large gap alignment—Option / ± 1.5 µm 3σ[2]
Resolution—Vacuum + Hard Contact ≤ 1 µm; Hard Contact ≤ 1.5 µm; Soft Contact ≤ 2.0 µm; Proximity ≥ 3.0 µm[2]
Exposure wavelength—350–450 nm[2]
Lamp—Mercury arc lamp, 350 W[2]
Motorized backside focus—yes[2]
Motorized auto leveling—yes[2]
Auto gap setting—yes[2]
Size—2 in, 100 mm, 150 mm, 200 mm[2]
Thickness—0.1-10 mm[2]
Mercury arc lamp—350 W[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]epfl.chepfl.ch
  2. [2]cores.research.asu.educores.research.asu.edu