Waferpedia

Comparison ledger

20 36 SurfaceversusWSD-K2

Blanchard 20 36 Surface, Takatori WSD-K2, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
20 36 SurfaceBlanchard
WSD-K2Takatori
OEMBlanchardTakatori
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 20 36 SurfaceTakatori WSD-K2
Specifications
ConfigurationWith new Elecro-Matic Neutrol II Magnetic Chuck Control[1]—
Magnetic Chuck ControlElectro-Matic Neutrol II[1]—
Type—Single Wire Saw[2]
Positioning—Developed for achieving outstanding performance as capable as a multi wire saw[2]
Use cases—R&D, quality control, production, and university use[2]
Customization—Customer requirement customization[2]

Plan your fab

Building a Dicing & Grinding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]takatori-g.co.jptakatori-g.co.jp