Waferpedia

Comparison ledger

18 D SurfaceversusDAG 810 Automatic

Blanchard 18 D Surface, Disco DAG 810 Automatic, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
18 D SurfaceBlanchard
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 18 D SurfaceDisco DAG 810
Cited variants—
  • DAG 810 with Taiko Option[1]
Specifications
Voltage416 V[2]100 V[1]
Phase3 Phase[2]3 Phase[1]
Cycles50[2]—
Control Voltage110[2]—
MakeBlanchard[2]—
Model18 D[2]DAG 810[5]
Asset #153970[2]—
Power416 V, 3 phase[2]—
Configuration—Taiko Option[1]
Full Load Current—10 A[1]
Largest Load—3 A[1]
Interrupting Capacity—14 kA[1]
Spindle rated power—4.2 kW[4]
Rated torque—5.9 N·m[4]
Speed range—1,000 to 7,000 min⁻¹[4]
Wafer Sizes—8 inch[4]
Vintage—2016[4]
Frequency—50/60 Hz[1]
Wiring—3 Wire + Ground[4]
Control System—Original control system and safety guard, touchscreen interface[4]
OEM—Disco[5]
Machine type—Automatic Grinder[5]
Option—Taiko Option[1]
Power supply—100 V, 3 phase, 50/60 Hz[1]
Control system—Original control system[4]
Safety guard—Original safety guard[4]
Interface—Touchscreen interface[4]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]inventory listing
  3. [3]Equipment inventory listing
  4. [4]inventory listing
  5. [5]Equipment inventory listing