Waferpedia

Comparison ledger

2200 EVO Die Bonder Hybridversus10100

Besi 2200 EVO Die Bonder Hybrid, West Bond 10100, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
10100West Bond
OEMBesiWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBesi 2200 EVO Die Bonder HybridWest Bond 10100
Specifications
vintage2012[1]—

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Sources (2)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]Equipment inventory listing