Waferpedia

Comparison ledger

200 ACUversus803

Axcelis 200 ACU, Tegal 803, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 ACUAxcelis
803Tegal
OEMAxcelisTegal
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis NV GSD 200Tegal 803
Specifications
ConfigurationParts Machine[1]—
ManufacturerAxcelis[1]—
Model200 ACU[1]—
Tool typeAsher[1]Inline automatic wafer RF plasma etcher[5]
Wafer size200mm[3]—
Serial numberAU6A356AH[3]—
Computer systemM 200 PC, M 200[4]—
Part numberSC 4572 A[4]—
Volts208[4]—
Amps30[4]—
Equipment typeAsher[1]—
Wafer configuration8 inch[2]—
Process type—Plasma etch[5]
Wafer handling—Automatic[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]wotol.comwotol.com
  4. [4]semistarcorp.comsemistarcorp.com
  5. [5]semistarcorp.comsemistarcorp.com