ASM
LinDA alternatives
Comparable Packaging & Bonding equipment documented in the Waferpedia catalog.
6 comparable tools
Besi
2200 evo advanced
Packaging & Bonding
The Datacon 2200 evo advanced is a multi-chip die bonder offering ±3 µm placement accuracy and up to 7,000 UPH throughput for mass production applications.
MRSI
HVM3
Packaging & Bonding
MRSI-HVM3 is a high-precision die bonding platform for high-volume production, described by MRSI as a 3-micron class system.
Finetech
Lambda
Packaging & Bonding
Finetech Lambda is a die bonder with sub-micron placement accuracy, supporting thermocompression and ultrasonic bonding.
Applied Materials
0010-47763 ASSY ESC Bonded Monopolar Dual Heated
Packaging & Bonding
Applied Materials model 0010-47763 is an ASSY ESC Bonded Monopolar Dual Heated unit.
Applied Materials
0041-26723 Bonded Assembly
Packaging & Bonding
The Applied Materials 0041-26723 is a bonded assembly used in semiconductor packaging and bonding applications.
Logitech
1 WBS 1 Wafer Substrate
Packaging & Bonding
The Logitech 1 WBS 1 is a wafer substrate bonder for 6-inch wafers.
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