Waferpedia

Comparison ledger

Eagle Xtremeversus10100

ASM Eagle Xtreme, West Bond 10100, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
10100West Bond
OEMASMWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyASM EagleWest Bond 10100
Specifications
ConfigurationLast used to bond thin gold wire with diameter of 50um or 2 mils. But software can be changed to other configurations.[1]—

Plan your fab

Building a Packaging & Bonding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (1)Every fact above is drawn from these public sources
  1. [1]inventory listing