Comparison ledger
ASM AD 838 L, Finetech Lambda, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | AD 838 LASM | LambdaFinetech |
|---|---|---|
| OEM | ASM | Finetech |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | Wafer Loader | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ASM AD 838 | Finetech Lambda |
| Cited variants |
| |
| Specifications | ||
| Configuration | 50/60 Hz[1] | 50 x 50 mm Heating Plate with Gel/Waffle Pack station[9] |
| Voltage | 230 Vac[1] | — |
| Phase | 1 Phase[1] | — |
| Power Consumption | 1300 w[5] | — |
| Wafer size | Wafer Loader[6] | — |
| Power | 1300 w[7] | 80W Contact Chip Heater (CCH) with a single heated tool[9] |
| Frequency | 50/60 Hz[8] | — |
| Wafer Sizes | 6 inch, 8 inch[2] | — |
| Accuracy | — | 0.5 um[9] |
| Placement Accuracy | — | 0.5 μm (sub-micron)[9] |
| Bond Force Range | — | 0.2-20 N[9] |
| Heating Plate Size | — | 50 × 50 mm[9] |
| Side Process Camera | — | Included[9] |
| Y Axis Camera Shifter | — | Included[9] |
| Fine Theta Adjustment on Bond Head | — | Included[9] |
| Dispense Syringe Mount Hardware | — | Included (no controller)[9] |
| Operating System | — | Windows 10 Pro[9] |
| Bonding Technologies | — | Thermocompression and ultrasonic[11] |
| Inert/Process Gas Enclosure | — | Included (on asset 153908)[10] |
| XY & Coplanarity Calibration Kit | — | Included (on asset 153908)[10] |
| Software | — | Finetech Software[9] |
| Placement Accuracy (description) | — | sub-micron[11] |
| Heating Plate | — | 50 x 50 mm with Gel/Waffle Pack station[9] |
| Control System | — | Windows 10 Pro PC[9] |
| Fine Theta Adjustment | — | Present on bond head[9] |
| Dispense Syringe Mount | — | Hardware only (no controller)[9] |
| Bond Line Adjust/Control Module | — | Present[9] |
| Contact Chip Heater | — | 80W (CCH) with single heated tool[10] |
| Substrate Heater (optional) | — | 100 x 100 mm with Gel/Waffle Pack station[9] |
| Placement accuracy | — | Sub-micron placement accuracy[11] |
| Bond technologies | — | Thermocompression and ultrasonic technologies[11] |
| Heating plate | — | 50 x 50 mm Heating Plate with Gel/Waffle Pack station[9] |
| Bond force range | — | 0.2-20N Bond Force Module[9] |
| Bond head theta adjustment | — | Fine Theta Adjustment on Bond Head[9] |
| Vision | — | Side Process Camera[9] |
| Camera shifter | — | Y Axis Camera Shifter[9] |
| Adhesive dispensing hardware | — | Dispense Syringe Mount Hardware – no controller[9] |
| Process gas enclosure | — | Inert/Process Gas Enclosure[10] |
| Contact chip heater | — | 80W Contact Chip Heater (CCH) with a single heated tool[10] |
| Calibration kit | — | XY & Coplanarity calibration kit[10] |
| Control PC | — | Windows 10 Pro PC, Keyboard, Mouse & Monitor[9] |
| Bond line control | — | Bond Line Adjust/Control Module[9] |
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