Comparison ledger
Applied Materials Mirra, Lapmaster 12 Lapper, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | MirraApplied Materials | 12 LapperLapmaster |
|---|---|---|
| OEM | Applied Materials | Lapmaster |
| Category | CMP | CMP |
| Wafer size | Platen3 - Wafer Buff | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | 2000– | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials Mirra | — |
| Cited variants | — | |
| Specifications | ||
| Software | MP2B6.2_28[1] | — |
| Configuration | 3 Polish Platens:[1] | — |
| Wafer size | Platen3 - Wafer Buff[1] | — |
| OEM | Applied Materials[1] | — |
| Model | Mirra[1] | — |
| Equipment type | CMP (Chemical Mechanical Polisher)[1] | — |
| Polish platens | 3[1] | — |
| Platen 1 | STD polish[1] | — |
| Platen 2 | STD polish[1] | — |
| Platen 3 | Wafer Buff[1] | — |
| Polish heads | 4[1] | — |
| Flow controllers | Entegris[1] | — |
| Robot arm | Applied Materials[1] | — |
| Vintage | 1999[1] | — |
| Outside plate diameter | — | 12 inches[4] |
| Lapping Speed Range | — | 0 to 60 rpm[5] |
| Wafer Size Compatibility | — | 4 inches or smaller[4] |
| Input Voltage | — | 110 V[4] |
| Frequency | — | 60 Hz[4] |
| Phase | — | 1[4] |
| Number of Rings | — | 3[4] |
| Number of Weights | — | 3[4] |
| Includes Slurry System | — | Yes[4] |
| Includes Timer | — | Yes[4] |