Comparison ledger
Applied Materials Mirra 3400, Lapmaster 72, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Mirra 3400Applied Materials | 72Lapmaster |
|---|---|---|
| OEM | Applied Materials | Lapmaster |
| Category | CMP | CMP |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | 1998 Vintage · 2001 Vintage | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials Mirra | Lapmaster 72 |
| Cited variants |
| |
| Specifications | ||
| Cassette Que | 4 Wet[6] | — |
| Handling | Wet In / Wet Out[6] | — |
| Platens | 3[6] | — |
| Polish Heads | 4[6] | — |
| Slurry Delivery | Rotary pump (6)[6] | — |
| Slurry Configuration | AB, AB w/ Position Sensor[6] | — |
| Slurry Delivery Arm Type | Extended w/ 4 Outputs[6] | — |
| ISRM P 1 | iScan / Full Scan/M. Torque[6] | — |
| ISRM P 2 | Full Scan/M. Torque[6] | — |
| ISRM P 3 | Full Scan/M. Torque[6] | — |
| UPA | IT / RR / MEM[6] | — |
| UPA Supply | Nitrogen Gas[6] | — |
| Head Types | Titan I[6] | — |
| Pad Conditioner | DDF 3[6] | — |
| Min / Max Platen Speed | 0 -125 rpm[6] | — |
| Min / Max Slurry Flow | 15 - 400 ml/mn[6] | — |
| Min / Max Head pressure | 0.7 - 14 psi[6] | — |
| Min / Max PC Downforce | 3.0 - 17 lbf[6] | — |
| Endpoint Software | IB 11 J 1[6] | — |
| Polisher Software | mp 2 B 6.2_36[6] | — |
| Wafer sizes | 150 mm, 200 mm (6 inch, 8 inch)[6] | — |
| Number of platens | 3[6] | — |
| Number of polish heads | 4[6] | — |
| Head type | Titan I[6] | — |
| Platen speed range | 0 – 125 rpm[6] | — |
| Slurry flow rate range | 15 – 400 ml/min[6] | — |
| Head pressure range | 0.7 – 14 psi[6] | — |
| PC downforce range | 3.0 – 17 lbf[6] | — |
| Handling type | Wet In / Wet Out[6] | — |
| Operating system | Windows NT 4.00.1381 or above[2] | — |
| Electrical requirements | 200/208 VAC, 200 A, 45 kVA[7] | — |
| Endpoint software version | IB 11 J 1[6] | — |
| Polisher software version | mp 2 B 6.2_36[6] | — |
| Number of polishing heads | 4[6] | — |
| Min/Max slurry flow | 15 - 400 ml/min[6] | — |
| Polisher software | mp 2 B 6.2_36 / MB60a1 or above[6] | — |
| Line voltage | 200/208 VAC[2] | — |
| Line frequency | 50 Hz[2] | — |
| Circuit breaker rating | 200 A[2] | — |
| SECS/GEM interface | Yes[2] | — |
| Hard drive configuration | Dual hard disk, XP / 68 pin SCSI[6] | — |
| Memory | 128 MB or above[2] | — |
| CPU | Pentium III or above[2] | — |
| Manufacturer | Applied Materials[6] | — |
| Model | Mirra 3400[6] | 72[4] |
| Category | CMP[8] | — |
| Wafer size | 200 mm[2] | — |
| Version | 200 mm[2] | Open Face[3] |
| Vintage | 1998[8] | — |
| Configuration | Stand-Alone Oxide/STI CMP[2] | 27" ID Rings[4] |
| Voltage | — | 480 V[4] |
| Plate Diameter | — | 72 inches (1829 mm)[5] |
| Number of Conditioning Rings | — | 4[3] |
| Ring Inside Diameter | — | 27.25 inches (692 mm)[5] |
| Standard RPM | — | 30[5] |
| RPM Range (Variable Speed Drive) | — | 5–32[5] |
| Drive Motor (Lapper) | — | 20 HP / 15 kW[5] |
| Drive Motor (alternate listing) | — | 25 HP[1] |
| Working Height | — | 36 inches (914 mm)[5] |
| Dimensions (Open Face) | — | 100 inches x 110 inches x 63 inches (2540 mm x 2794 mm x 1600 mm)[5] |
| Dimensions (Pneumatic Lift) | — | 124 inches x 110 inches x 108 inches (3150 mm x 2794 mm x 2743 mm)[5] |
| Est. Shipping Weight (Open Face) | — | 15,000 lbs (6804 kg)[5] |
| Est. Shipping Weight (Pneumatic Lift) | — | 20,000 lbs (9072 kg)[5] |
| Ring Height | — | 4.0 inches[1] |
| Plate Thickness | — | 1-5/8 inches[1] |
| Machine type | — | Polisher[4] |
| Plate diameter | — | 72 in[5] |
| Conditioning rings | — | 4[3] |
| Ring ID | — | 27.25 in[5] |
| Ring size | — | 27" ID rings[4] |
| Speed range | — | 5-32 RPM[4] |
| RPM range with variable speed drive | — | 5-32[5] |
| Drive motor | — | 25 HP[4] |
| Overall dimensions, Open Face | — | 100 in x 110 in x 63 in H[5] |
| Weight, Open Face | — | 15,000 lbs[5] |
| Serial number | — | 7200010[1] |
| Year stated in source | — | 2001[1] |