Waferpedia

Comparison ledger

Centura eMXP+versus200 ACU

Applied Materials Centura eMXP+, Axcelis 200 ACU, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Centura eMXP+Applied Materials
200 ACUAxcelis
OEMApplied MaterialsAxcelis
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials CenturaAxcelis NV GSD 200
Specifications
ConfigurationOxide[1]Parts Machine[2]
Software VersionE4.8_26[1]—
Voltage208 VAC[1]—
Full load current240A[1]—
Frequency50/60 Hz[1]—
ProcessNitride Spacer[1]—
Wafer size8 inch[1]200mm[4]
RobotHP+ Robot[1]—
ExcludesLPT, Chiller, Dry Pump[1]—
Manufacturer—Axcelis[2]
Model—200 ACU[2]
Tool type—Asher[2]
Serial number—AU6A356AH[4]
Computer system—M 200 PC, M 200[5]
Part number—SC 4572 A[5]
Volts—208[5]
Amps—30[5]
Equipment type—Asher[2]
Wafer configuration—8 inch[3]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]semistarcorp.comsemistarcorp.com
  4. [4]wotol.comwotol.com
  5. [5]semistarcorp.comsemistarcorp.com