Waferpedia

Comparison ledger

0041-39086 ESC Partversus903e

Applied Materials 0041-39086 ESC Part, Tegal 903e, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0041-39086 ESC PartApplied Materials
903eTegal
OEMApplied MaterialsTegal
CategoryEtchEtch
Wafer size—75 mm to 150 mm round substrates; rectangular substrates from 100 mm to 125 mm on a side
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones—2000 sale announced · 2001 order announced
Control system——
Generation——
Family—Tegal 903e
Specifications
Tool type—diode plasma etch tool[1]
Substrate diameter range—75 mm to 150 mm round silicon and gallium arsenide (GaAs) substrates[1]
Substrate format—rectangular substrates from 100 mm to 125 mm on a side[1]
Wafer/substrate capacity—75 mm to 150 mm round substrates[1]
Rectangular substrate capacity—100 mm to 125 mm on a side[1]
Configured form—"through the wall" configuration[3]
Application—etching oxide contacts[1]

Plan your fab

Building a Etch process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]web.archive.orgweb.archive.org
  3. [3]web.archive.orgweb.archive.org