Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, Palomar 3880, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | 3880Palomar |
|---|---|---|
| OEM | Applied Materials | Palomar |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | Palomar 3880 |
| Specifications | ||
| Machine type | — | Component placement die attach system[1] |
| Bond head | — | Integrated Z-Theta bidirectional 8-tool bond head[1] |
| Capabilities | — | Supports eutectic and epoxy die attach, flip chip, and a range of options in a single machine[1] |
| Process types listed | — | Silver Sintering Die Bonding, Eutectic Die Bonding, Epoxy Die Bonding, UV Die Bonding, Solder Paste Die Bonding, Thermocompression Die Bonding[1] |
| Machine use in services | — | Used for wafer (up to 12") deep access wafer sealing applications[2] |
| Supported process | — | Eutectic die attach[1] |
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