Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, Hesse & Knipps BJ 820 Wire Bonder Transport, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | BJ 820 Wire Bonder TransportHesse & Knipps |
|---|---|---|
| OEM | Applied Materials | Hesse & Knipps |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | Hesse & Knipps BJ 820 Wire Bonder Transport |
| Specifications | ||
| Make | — | Hesse & Knipps (H&K)[1] |
| Model | — | BJ 820[1] |
| Description | — | Wire Bonder Transport System[1] |
| Vintage | — | 2013[1] |
| Work area | — | 305 mm x 410 mm[2] |
| Type | — | High Speed Fully Automatic Wedge Bonder[2] |
| Wire materials | — | Aluminium or gold wire or ribbon[2] |
| Equipment type | — | Wire Bonder Transport System[1] |
| Machine description | — | High Speed Fully Automatic Wedge Bonder[2] |
| Working area | — | 305 mm x 410 mm (12.3" x 16.14")[2] |
| Speed | — | Up to 7 wires per second[2] |
| Wire diameter range | — | 17.5 μm – 60 μm; optional 12.5 μm – 85 μm[2] |
| Ribbon materials | — | Al, Au[2] |
| Ribbon range | — | 6 μm x 35 μm – 25 μm x 250 μm[2] |
| Footprint | — | 722 mm x 1250 mm[2] |
| Integrated controls | — | Integrated PLC controller; standard SMEMA input and output ports; Profibus support[2] |
Plan your fab
Building a Packaging & Bonding process? Get a complete equipment list.
Open the fab equipment planner →