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Comparison ledger

0020 54137 PartversusiFlex

Applied Materials 0020 54137 Part, Assembleon iFlex, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0020 54137 PartApplied Materials
iFlexAssembleon
OEMApplied MaterialsAssembleon
CategoryAssembly / SMTAssembly / SMT
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 54137 PartAssembleon iFlex
Cited variants—
Specifications
ConfigurationConn Ector Copper Threaded W / Solder Ptg[2]—
Placement Speed (max per hour)—70,000 CPH (iFlex T4)[1]
Placement Accuracy—±40 microns (chips); 35 microns (QFP); Cpk > 1[1]
Minimum Component Size—0.4 x 0.2 mm (01005)[1]
Maximum Component Size—17.5 x 17.5 x 15 mm (iFlex T4); 45 x 45 x 21 mm (iFlex T2); 120 x 52 x 25 mm (iFlex H1)[1]
Maximum Board Size—525 x 558 mm (single lane); 525 x 254 mm (dual lane)[1]
Minimum Board Size—50 x 50 mm[1]
Board Thickness—0.3 to 6 mm[1]
Placement Quality—< 1 dpm (defects per million)[1]
Maximum Tape Feeding Positions (8 mm)—64 single tapes, 128 twin tapes (iFlex T4/T2); 71 single tapes, 142 twin tapes (iFlex H1)[1]
Footprint (L x W)—1,170 x 1,844 mm[1]
Data Interface—CamX[1]
Placement Force (Programmable)—1.5 to 8 N (iFlex T4/T2); 4.0 to 30 N (iFlex H1)[1]
Maximum Component Height (Standard)—15 mm (iFlex T4/T2); 25 mm (iFlex H1)[1]
Maximum Component Height (Optional)—35 mm (iFlex T2)[1]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]efsmt.comefsmt.com
  2. [2]inventory listing