Comparison ledger
Applied Materials 0020 17485 Part, CHA 635, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0020 17485 PartApplied Materials | 635CHA |
|---|---|---|
| OEM | Applied Materials | CHA |
| Category | Deposition | Deposition |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0020 17485 Part | CHA 635 |
| Cited variants | — | |
| Specifications | ||
| Configuration | Strap, RF Out 2 Balanced Coil Match, Hdp[2] | — |
| Applications | — | sputtering and evaporation[1] |
| Modularity | — | add capability and capacity as needed[1] |
| Options | — | class 10 mini-environment[1] |
| Wafer handling | — | AGV-compliant cassette-to-cassette robotic wafer handling[1] |
| Control | — | touch screen PLC control[1] |
| GUI | — | Wonderware GUI[1] |
| Process types | — | Sputtering and evaporation[1] |
| Control system | — | Touch screen PLC control and Wonderware GUI[1] |
| Source-to-substrate throw (635/SL) | — | 45 inches[3] |
| Wafer starts per hour (635/RL) | — | Up to 100 x 150mm wafer starts per hour[3] |
| Wafer handling (635/RL) | — | SEMI Class 10 fully-robotic, cassette-to-cassette[3] |
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