Waferpedia

Comparison ledger

0020 17485 PartversusCentura 5200 HTF RP EPI

Applied Materials 0020 17485 Part, Applied Materials Centura 5200 HTF RP EPI, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0020 17485 PartApplied Materials
Centura 5200 HTF RP EPIApplied Materials
OEMApplied MaterialsApplied Materials
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 17485 PartApplied Materials Centura 5200
Specifications
ConfigurationStrap, RF Out 2 Balanced Coil Match, Hdp[1]3 Chamber[2]
Process Type—Reduced Pressure Epitaxial Silicon Deposition[2]
Number of Chambers—3[2]
Condition—Refurbished[2]

Plan your fab

Building a Deposition process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing