Comparison ledger
Applied Materials 0010 47763, Tegal 981ACS, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010 47763Applied Materials | 981ACSTegal |
|---|---|---|
| OEM | Applied Materials | Tegal |
| Category | Etch | Etch |
| Wafer size | — | 150mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010 47763 | Tegal 981ACS |
| Specifications | ||
| Configuration | 2nd Source New[1] | — |
| Type | Monopolar Dual Heated[2] | — |
| Description | ASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[3] | — |
| Possible Materials | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[2] | — |
| Model | 0010-47763[1] | — |
| OEM | Applied Materials[1] | — |
| Material (possible) | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[2] | — |
| Application | Fixing wafers in etching process (PVD, CVD, ETCH)[2] | — |
| Quantity available (source) | 1[2] | — |
| Wafer size (diameter) | — | 150 mm, 200 mm[4] |
| Wafer size (square) | — | 100 mm square, 6-inch square[4] |
| Reactor type | — | Wide-gap diode (scaled-up version of 901ACS)[4] |
| Applications | — | Non-critical photoresist removal, photoresist trimming, large-scale etching, planarization, backside etching, BioChip nanotechnology[4] |
| Footprint | — | Small; no external rack-mount electronics[4] |
| User interface | — | Intuitive touchscreen interface[4] |
| Maintenance | — | Long-lasting, low maintenance parts[4] |
| Wafer handling | — | Cassette to cassette (no manual handling)[4] |
| Temperature control | — | All electrodes precisely temperature controlled[4] |
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