Waferpedia

Comparison ledger

0010 47763versus2300 Exelan Flex

Applied Materials 0010 47763, Lam Research 2300 Exelan Flex, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010 47763Applied Materials
2300 Exelan FlexLam Research
OEMApplied MaterialsLam Research
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010 47763Lam Research 2300
Specifications
Configuration2nd Source New[1]50/60 Hz[4]
TypeMonopolar Dual Heated[2]—
DescriptionASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[3]—
Possible MaterialsAl2O3 (aluminum oxide) or AlN (aluminum nitride)[2]—
Model0010-47763[1]2300 Exelan Flex[5]
OEMApplied Materials[1]—
Material (possible)Al2O3 (aluminum oxide) or AlN (aluminum nitride)[2]—
ApplicationFixing wafers in etching process (PVD, CVD, ETCH)[2]—
Quantity available (source)1[2]—
Voltage—208 VAC[4]
Full Load Current—56 A[4]
Main CB Current Rating—70 A[4]
Wafer Size—12 inch (300 mm)[5]
Frequency—50/60 Hz[4]
Make—Lam[5]
Wafer Sizes—12 inch[5]
Equipment type—Etch Chamber[5]
Power—208 VAC, 50/60 Hz[4]
Vintage—2006[4]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]saulcontrol.comsaulcontrol.com
  3. [3]getspares.comgetspares.com
  4. [4]inventory listing
  5. [5]Equipment inventory listing
  6. [6]Equipment inventory listing