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0010-47763 ASSY ESC Bonded Monopolar Dual HeatedversusIConn MEM Plus

Applied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual Heated, Kulicke & Soffa IConn MEM Plus, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
IConn MEM PlusKulicke & Soffa
OEMApplied MaterialsKulicke & Soffa
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual HeatedKulicke & Soffa IConn MEM Plus
Specifications
ConfigurationRefurbished[1]—
Ultra Fine Pitch—35 μm[2]
Gold wire diameter—0.6 mil to 2.0 mil[2]
Silver alloy wire diameter—0.6 mil to 2.0 mil[2]
Bonding Area (X)—56 mm[2]
Bonding Area (Y)—80 mm[2]
Total Bond Placement Accuracy—2.0 μm @ 3 sigma[2]
Maximum Wire Length (1.0 mil wire)—7.6 mm[2]
Maximum Wire Length (0.6 mil wire)—3.0 mm[2]
Minimum Loop Height (0.6 mil wire)—40 μm[2]
Input Voltage—200-240 VAC, single phase, 50/60 Hz[2]
Power Consumption (nominal)—1.5 KVA[2]
Power Consumption (max)—2.6 KVA[2]
Footprint—889 mm x 1009 mm (35" x 39.7")[2]
Weight (machine only)—620 kg (1367 lbs)[2]
Minimum Air Pressure—3.52 kg/sq cm (50 psi)[2]
Nominal Air Consumption—185 liters/min @ 4.6 kg/sq cm (6.5 CFM @ 65 psi)[2]
Cover Gas Consumption (nominal)—0.9 liters/min[2]
Setup Time (same leadframe type)—< 4 min[2]
Setup Time (different leadframe type)—< 8 min[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]elexind.itelexind.it