Waferpedia

Comparison ledger

0010-47763 ASSY ESC Bonded Monopolar Dual HeatedversusADL 838 LG 2

Applied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual Heated, ASM ADL 838 LG 2, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMApplied MaterialsASM
CategoryPackaging & BondingPackaging & Bonding
Wafer size—Wafer System:
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual HeatedASM ADL 838
Specifications
ConfigurationRefurbished[1]0 hours ran[2]
Wafer size—Wafer System:[2]
Input type—clamp ring / wafer expander[2]
PR system—full color, 256 grey levels[2]
Voltage—100 - 240 VAC (single phase)[2]
Frequency—50/60 Hz[2]
Full-load consumption—~ 1,500 W[2]
UPH—14,000+ (ASMPT in-house test)[2]
Die Size—6 x 6 mil - 80 x 80 mil[2]
Flip Chip Handling—standard[2]
Length—2.36" - 11.81"[2]
OEM—ASM[2]
Model—ADL 838 LG 2[2]
Category—Packaging & Bonding[3]
Tool type—Die bonder[2]
Wafer system—ASM ADL 838 family[3]
Pattern recognition system—full color, 256 grey levels[2]
Die size—6 x 6 mil - 80 x 80 mil (0.15 x 0.15mm - 2.03 x 2.03mm)[2]
Die size without up-look inspection—6 x 6 mil - 400 x 400 mil (0.15 x 0.15 mm - 10.16 x 10.16 mm)[2]
Substrate length—2.36" - 11.81"[2]
Substrate width—2.36" - 3.94"[2]
Substrate thickness—5 - 118 mil[2]
Magazine length—2.36" - 12.20"[2]
Magazine width—2.36" - 4.33"[2]
Magazine height—2.68" - 7.48"[2]
Bond force—Programmable (30 - 300g)[2]
Bond head—High force bond head[2]
Condition—0 hours ran[2]
Width—2.36" - 3.94"[2]
Thickness—5 - 118 mil[2]
Height—2.68" - 7.48"[2]

Plan your fab

Building a Packaging & Bonding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]waferpedia.comwaferpedia.com