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0010-22161 High EFF RF MatchversusM 6000 Lift Off

Applied Materials 0010-22161 High EFF RF Match, SUSS MicroTec M 6000 Lift Off, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
M 6000 Lift OffSUSS MicroTec
OEMApplied MaterialsSUSS MicroTec
Category——
Wafer size——
Process node——
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FamilyApplied Materials 0010-22161 High EFF RF MatchSUSS MicroTec M 6000 Lift Off
Specifications
MakeApplied Materials[1]—
Model0010-22161[1]—
DescriptionHTESC PH 1 REV A[2]—
ConditionUsed[2]Remodeled in 2001[4]
Stock NumberBM6628[2]—
Configuration—New module (soak process)[3]
Wafer Sizes—3, 4 inch[4]
Sources (4)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]tarasemi.comtarasemi.com
  3. [3]waferpedia.comwaferpedia.com
  4. [4]inventory listing