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0010-22161 High EFF RF MatchversusMPM 125

Applied Materials 0010-22161 High EFF RF Match, MPM MPM 125, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMApplied MaterialsMPM
Category——
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-22161 High EFF RF MatchMPM MPM 125
Cited variants—
Specifications
MakeApplied Materials[2]—
Model0010-22161[2]—
DescriptionHTESC PH 1 REV A[3]—
ConditionUsed[3]—
Stock NumberBM6628[3]—
Maximum Board Size—609.6 mm x 508 mm (24" x 20")[4]
Minimum Board Size—50.8 mm x 50.8 mm (2" x 2")[4]
Board Thickness—0.2 mm (0.008") to 5.0 mm (0.20"), up to 6.0 mm (0.24") without top clamp[4]
Maximum Board Weight—4.5 kg (9.92 lbs)[4]
Underside Clearance—12.7 mm (0.5") standard, configurable for 25.4 mm (1.0")[4]
Maximum Print Area—609.6 mm x 508 mm (24" x 20")[4]
Print Gap—0 mm to 6.35 mm (0" to 0.25")[4]
Print Speed—Up to 305 mm/sec (12.0"/sec)[4]
Print Force—0 to 20 kg (0 lb to 44 lbs)[4]
Stencil Frame Size—737 mm x 737 mm (29" x 29")[4]
Vision Field-of-View—10.6 mm x 8.0 mm (0.417" x 0.315")[4]
Camera System—Single digital camera - patented look up/down vision[4]
Total System Alignment Accuracy—±12.5 microns at 6 sigma, Cpk >= 2.0[4]
Cycle Time—13 seconds[4]
Power Requirements—200 to 240 VAC single phase @50/60 Hz, 15 A[4]
Air Supply Requirements—100 psi at 4 cfm (standard) to 18 cfm (vacuum wipe) (7 bar @ 5 L/s to 12 L/s), 12.7 mm diameter line[4]
Machine Height—1,940 mm (37.0")[4]
Machine Depth—1,593.1 mm[4]
Machine Width—1,202.7 mm[4]
Machine Weight—816.5 kg[4]
Crated Weight—1110 kg[4]
Control Software—Benchmark software on Windows XP SP3[1]
Sources (4)Every fact above is drawn from these public sources
  1. [1]smtnet.comsmtnet.com
  2. [2]Equipment inventory listing
  3. [3]tarasemi.comtarasemi.com
  4. [4]anubiss.nlanubiss.nl